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| Conversion & Modification of Auto Molding System(AMS) |
| Advantage & Features |
| ▶▶ Used & old AMS can be salvaged for new package application |
| ▶▶ Existing AMS can be converted for new package application |
| ▶▶ Spare chase assembly & conversion kit can be supplied by reverse engineering technology |
| ▶▶ Brand names to be applied : All kinds of AMS in the world |
| ▶▶ Cost reduction : To be supplied with lowest price |
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| Auto Trim & Soldering System |
| Major Specification |
| ▶▶ Application Package : TO-220 |
| ▶▶ Tool Process : Degate & D/B Cut ⇒ Lead Length Cut(Singulation) |
| ▶▶ Solder Progression : Flux Cleaning ⇒ Pre-Heating ⇒ Soldering ⇒ Cleaning ⇒ Drying |
| ▶▶ Offloading : 'Bulk Box' or 'Tube' Offloading |
| ▶▶ SPM : Min. 80 |
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| Auto L/F Down-Set & Taping System |
| Major Specification |
| ▶▶ Application Package : MQUAD |
| ▶▶ SPM : Single Tape ~ 65 SPM, Multi Tape ~ 40 SPM |
| ▶▶ Tape Index Feeding : Mechanical CAM Indexing & Floating |
| ▶▶ Solder Progression : Flux Cleaning ⇒ Pre-Heating ⇒ Soldering ⇒ Cleaning ⇒ Drying |
| ▶▶ Offloading : 'Bulk Box' or 'Tube' Offloading |
| ▶▶ SPM : Min. 80 |
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| Auto Detacher(Auto Pick&Place) System for F-BGA/CABGA/TBGA/CSP |
| Major Specification |
| ▶▶ Applicable Package : F-BGA & CABGA/CSP/TBGA |
| ▶▶ 1st Vision Inspection for Ball & 2nd Vision Inspection for Package |
| ▶▶ UPH : 3,600 (by Multi-Picker) |
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| Singulation System for μ-BGA/F-BGA |
| Major Specification |
| ▶▶ QCC type Module for easy maintenance |
| ▶▶ 1st Vision Inspection for Package & 2nd Vision Inspection for Ball |
| ▶▶ UPH : 6,500 ~ 7,200 |
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| Tape Lamination System for TABGA/FBGA/QFN(MLF) |
| Major Specification |
| ▶▶ Available for both ‘Tape Lamination’ & ‘Metal Ground Lamination’ |
| ▶▶ Available for 31x31, 35x35, 37.5x37.5, 40x40 (50x179mm Metal Frame) |
| ▶▶ UPH : 600 ~ 1500 or more (*depends on pkg type & design) |
| ▶▶ Cavity Window Burr : Max. 0.03 mm |
| ▶▶ Press : Servo Mechanical CAM |
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| Auto Trim/FormSing. System(CAM) |
| Major Specification |
| ▶▶ Application Package : TO-220 |
| ▶▶ Tool Process : Degate & D/B Cut ⇒ Lead Length Cut(Singulation) |
| ▶▶ Solder Progression : Flux Cleaning ⇒ Pre-Heating ⇒ Soldering ⇒ Cleaning ⇒ Drying |
| ▶▶ Offloading : 'Bulk Box' or 'Tube' Offloading |
| ▶▶ SPM : Min. 80 |
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| Auto Trim/Form/Sing'System(*NEW Motor & Pulley - Belt Press) |
| Major Specification |
| ▶▶ New ‘Motor & Pulley-Belt with Eccentric CAM Shaft’ |
| ▶▶ Press Tonnage : 3ton or 5ton |
| ▶▶ Magazine Onloading / Magazine or Tube Offloading |
| ▶▶ PLC Control with P.C Touch Screen & Ten Key |
| ▶▶ S.P.M : 100~200 (*Depends on package type & design) |
| ▶▶ No Chip-out, No Scratch, No Visual Crack or Micro Crack, No Bent or Damaged Lead |
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| Auto L/F LoadingSystem |
| Major Specification |
| ▶▶ Available for All Packages |
| ▶▶ Control System : PLC |
| ▶▶ Loading Time : Max. 30~50sechttp://micron.co.kr/page/cycle |
| ▶▶ Robot : X Robot/ X-Y Robot/ Scara Robot |
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| Auto Pellet Loading System |
| Major Specification |
| ▶▶ Required for MGP Mold |
| ▶▶ Auto Pellet Loading to Manual Pellet Jig |
| ▶▶ Clean Environment for Production Area |
| ▶▶ Yield Improvement |
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| Auto Trim/Singulation System(Reel-Tape Onloading) |
| Major Specification |
| ▶▶ Servo Mechanical CAM Press |
| ▶▶ Reel-Tape On-Loading |
| ▶▶ Bulk Box Off-Loading |
| ▶▶ P.C Control & Monitoring System |
| ▶▶ SPM : 100 ~ 120 |
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| Auto Laser Marking System |
| Major Specification |
| ▶▶Process : Magazine On-Loading ⇒ Laser Marking ⇒ Post Cleaner ⇒ Post Vision ⇒ Strip Sorter ⇒ Magazine Off-Loadeing |
| ▶▶Laser Marking : Diode Pumping Method to be used(“Yag Laser”) |
| ▶▶Camera Resolution : 1,024 x 1,300 |
| ▶▶Scan Head Range(*depends on strip size) |
| *. Single Head : 180mm x 180mm |
| *. Dual Head : 180mm x 360mm |
| ▶▶Vision Inspection : Wrong Mark, Illegible Mark, Missing Mark, No Mark |
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| Auto Pin Insert Machine |
| Major Specification |
| ▶▶ Automatic Loading of BGA Socket Contact |
| ▶▶ Contact Loading Speed : Max. 200SPM |
| ▶▶ Contact Insert Pitch : 0.80mm / 0.75mm / 0.65mm / 0.50mm |
| ▶▶ Contact Insert Quantity : 1unit / time |
| ▶▶ System Control : P.C Control & Monitoring |
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| Auto Tape Carrier Embossing Maching |
| Major Specification |
| ▶▶ Productivity : Max. 60 SPM |
| ▶▶ Machine Size : Main Body L1800 x W1700 x H1700 mm |
| ▶▶ Machine Size : Reel Winder L1400 x W700 x H1700 mm |
| ▶▶ Index : Max. 48mm/shot |
| ▶▶ Index : Applicable carrier tape width : 32~56mm |
| ▶▶ Vision Inspection : Tape Carrier Inspection Vision |
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