미크론정공(주)

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세미콤사업부

미래를 내다보는 기업 가까운 곳에 있습니다.

미크론정공(주)은 반도체 금형장비 전문 기업으로써 지금까지 노력해 왔습니다.
항상 최고를 향해 나갈 것을 약속 드립니다.

 
Test Socket & Connectors
 
▶▶ Housing for Various Test Socket
▶▶ TSOP, BGA, CSP and CLCC 등과 같은 다양한 Type의 Burn-in Sockets Mold를 제작 공급하고 있습니다.
 
 
   
CSP GBA Sockets
 
▶▶ Available in compression Mount or Through-hole.
   
BGA Memory Sockets
 
▶▶ Application Package : MQUAD
▶▶ SPM : Single Tape ~ 65 SPM, Multi Tape ~ 40 SPM
▶▶ Tape Index Feeding : Mechanical CAM Indexing & Floating
▶▶ Solder Progression : Flux Cleaning ⇒ Pre-Heating ⇒ Soldering ⇒ Cleaning ⇒ Drying
▶▶ Offloading : 'Bulk Box' or 'Tube' Offloading
▶▶ SPM : Min. 80
   
Auto Detacher(Auto Pick&Place) System for F-BGA/CABGA/TBGA/CSP
Major Specification
▶▶ Applicable Package : F-BGA & CABGA/CSP/TBGA
▶▶ 1st Vision Inspection for Ball & 2nd Vision Inspection for Package
▶▶ UPH : 3,600 (by Multi-Picker)
   
Singulation System for μ-BGA/F-BGA
Major Specification
▶▶ QCC type Module for easy maintenance
▶▶ 1st Vision Inspection for Package & 2nd Vision Inspection for Ball
▶▶ UPH : 6,500 ~ 7,200
   
Tape Lamination System for TABGA/FBGA/QFN(MLF)
Major Specification
▶▶ Available for both ‘Tape Lamination’ & ‘Metal Ground Lamination’
▶▶ Available for 31x31, 35x35, 37.5x37.5, 40x40 (50x179mm Metal Frame)
▶▶ UPH : 600 ~ 1500 or more (*depends on pkg type & design)
▶▶ Cavity Window Burr : Max. 0.03 mm
▶▶ Press : Servo Mechanical CAM
   
Auto Trim/FormSing. System(CAM)
Major Specification
▶▶ Application Package : TO-220
▶▶ Tool Process : Degate & D/B Cut ⇒ Lead Length Cut(Singulation)
▶▶ Solder Progression : Flux Cleaning ⇒ Pre-Heating ⇒ Soldering ⇒ Cleaning ⇒ Drying
▶▶ Offloading : 'Bulk Box' or 'Tube' Offloading
▶▶ SPM : Min. 80
   
Auto Trim/Form/Sing'System(*NEW Motor & Pulley - Belt Press)
Major Specification
▶▶ New ‘Motor & Pulley-Belt with Eccentric CAM Shaft’
▶▶ Press Tonnage : 3ton or 5ton
▶▶ Magazine Onloading / Magazine or Tube Offloading
▶▶ PLC Control with P.C Touch Screen & Ten Key
▶▶ S.P.M : 100~200 (*Depends on package type & design)
▶▶ No Chip-out, No Scratch, No Visual Crack or Micro Crack, No Bent or Damaged Lead
   
Auto L/F LoadingSystem
Major Specification
▶▶ Available for All Packages
▶▶ Control System : PLC
▶▶ Loading Time : Max. 30~50sechttp://micron.co.kr/page/cycle
▶▶ Robot : X Robot/ X-Y Robot/ Scara Robot
   
Auto Pellet Loading System
Major Specification
▶▶ Required for MGP Mold
▶▶ Auto Pellet Loading to Manual Pellet Jig
▶▶ Clean Environment for Production Area
▶▶ Yield Improvement
   
Auto Trim/Singulation System(Reel-Tape Onloading)
Major Specification
▶▶ Servo Mechanical CAM Press
▶▶ Reel-Tape On-Loading
▶▶ Bulk Box Off-Loading
▶▶ P.C Control & Monitoring System
▶▶ SPM : 100 ~ 120
   
Auto Laser Marking System
Major Specification
▶▶Process : Magazine On-Loading ⇒ Laser Marking ⇒ Post Cleaner ⇒ Post Vision ⇒ Strip Sorter ⇒ Magazine Off-Loadeing
▶▶Laser Marking : Diode Pumping Method to be used(“Yag Laser”)
▶▶Camera Resolution : 1,024 x 1,300
▶▶Scan Head Range(*depends on strip size)
*. Single Head : 180mm x 180mm
*. Dual Head : 180mm x 360mm
▶▶Vision Inspection : Wrong Mark, Illegible Mark, Missing Mark, No Mark
   
Auto Pin Insert Machine
Major Specification
▶▶ Automatic Loading of BGA Socket Contact
▶▶ Contact Loading Speed : Max. 200SPM
▶▶ Contact Insert Pitch : 0.80mm / 0.75mm / 0.65mm / 0.50mm
▶▶ Contact Insert Quantity : 1unit / time
▶▶ System Control : P.C Control & Monitoring
   
Auto Tape Carrier Embossing Maching
Major Specification
▶▶ Productivity : Max. 60 SPM
▶▶ Machine Size : Main Body L1800 x W1700 x H1700 mm
▶▶ Machine Size : Reel Winder L1400 x W700 x H1700 mm
▶▶ Index : Max. 48mm/shot
▶▶ Index : Applicable carrier tape width : 32~56mm
▶▶ Vision Inspection : Tape Carrier Inspection Vision