Housing for Various Test Socket
 
미크론 세미콤은 TSOP, BGA, CSP and CLCC 등과 같은 다양한 Type 의 Burn-in Sockets Mold 를 제작 공급하고 있습니다 .
 
CSP BGA Sockets
Available in compression Mount or Through-hole.
 
 
BGA Memory Sockets
Extensive Line of Memory Socket offerings.
Pitch Minimum Outline Maximum Outline
1.27mm 19.5 x 24 x 17 33.2 x 28.4
1.00mm 27.5 x 32.5 x 17 46.2 x 46.2 x 18.4
0.80mm 22 x 18 x 15.9 35 x 35 x 23
0.75mm 19 x 18 x 15.4 30 x 26.5 x 17.3
0.65mm 19 x 19 x 15.8 28 x 26 x 19
0.50mm 26 x 19.5 x 18.1 40 x 40 x 19.6
 
 
Land Grid Array(LGA) Package Quad Flat Pack(QFP) Package Side Contacting(SO) Package
 

 

Micron Semicom is maintain leading-edge equipment and facilities for very small size of camera module and also for various kind of precise optical injection products.
- MOBILE CAMERA AUTO FOCUCING MODULE
- MOBILE CAMERA ZOOM MODULE
- ACTUATOR OR OTHERS
 
 
     
 
email